Available Packages:
- Single in-line
- Dual in-line
- COB interposer
- BGA
- System in package
- Custom
Package Features:
- High-density thick film
- RF substrate materials
- Chip & wire
- Flip chip
- Stud bump bonding
- RF packaging
- Fine pitch SMT
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Core benefits:
- Seamless transfer from product design and prototype to volume production
- DFM and DFT guidance during new product development
- In-house thick film hybrid manufacture and assembly
- Experienced packaging that meets harsh electrical and mechanical environments
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