Bourns - Microelectronic Modules

Microelectronic Modules

Bourns demonstrated expertise in technology integration, assembly processes, packaging technology and product launch control results in faster time to market. Knowledgeable Bourns engineers provide a valuable, cost-effective resource across multiple environments and a broad range of applications that ensure enhanced functionality and compatibility from the design stage through manufacturing.

Bourns’ Packaging Solutions
Whether it’s a quick-turn prototype or high-volume manufacturing design, Bourns delivers:

Design compatibility
Miniaturization
RF performance
Precision assembly
High reliability
Cost-effective design
Thermal management
Environmental protection

Core benefits:

Seamless transfer from product design and prototype to volume production
DFM and DFT guidance during new product development
In-house thick film hybrid manufacture and assembly
Experienced packaging that meets harsh electrical and mechanical environments

Specialty Engineering and Manufacturing Services (SEMS)

Read about Bourns' Custom Packaging Solutions

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	Bourns offers Design Kits that include several of these product lines.

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